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Title

Equipment for low-cost, non-chemical patterning of flexible substrates and foils

Reference

TOSE20140609001

Last update

Tue, Sep, 30, 2014

Deadline

Wed, Jul, 08, 2015

Abstract

A Swedish SME has patented a method for dry phase patterning (DPP) of flexible substrates, all in one production step. This low cost and environmentally sustainable method can replace most etching processes, and expands the possible product range due to its cold and dry process. The SME is now looking for technical cooperation, mainly testing and adoption to specific needs, as well as commercial agreement with technical assistance, commercial agency and distribution services agreements.

Description

The Dry Phase Patterning (DPP) is a single step method for patterning metal or polymer layers on top of most flexible substrates. Examples of laminates patterned are: PEDOT/PE, Aluminum/Paper, Aluminum/PET, Copper/PET etc. The process is suitable for making e g antennas, heating foils, flexible PCBs etc.

The material is patterned in one single process step, unlike in a wet chemistry etch process, which may require up to 6-8 different steps. In the DPP process, the residual product is in a dry phase, contains no chemical products and it is recyclable. Thus, the method has large environmental benefits. Patterning of fibrous materials or products sensitive for fluids or chemicals has earlier been a problem. With the DPP method it is now possible to realize such products to a reasonable cost.

The DPP process has a high resolution; patterns with spacing smaller than 200 µm has been proved. Components easily produced are all kind of passive components on flexible substrate, such as conductors, resistors, inductors and antennas. Various sensor applications, as well as heating elements, are further examples of devices where the technology has been successful. Patterning can be performed at speeds up to 150 m/min. The resolution will not decrease with higher production speed.

The SME is looking for technical cooperation, mainly testing and adoption to specific needs, as well as commercial agreement with technical assistance, commercial agency and distribution services agreements.

Technology Keywords

Electronics, Microelectronics;Erosion, Removal (spark erosion, flame cutting, laser/plasma cutting, electrochemical erosion, waterjet cutting);Metals and Alloys;Plastics, Polymers

Keyword Codes:

001001;002002004;002007010;002007014

Current Stage of Development

Intellectual Property Rights

Patents granted

IPR Comments:

Patents granted in Japan, China, France Germany, Sweden, USA

Exploitation of RTD Results

Organisation/Company Type

Organisation/Company Size

Organisation Comments

Detailed Market Application Codes (VEIC)

MA Keyword

Data communication components;Electronic Components;Other consumer products;Packing products and systems;Other manufacturing (not elsewhere classified)

MA Keyword Codes:

001004002;003001;007004010;009004006;009004008

Application Domain Description:


Collaboration Type

Comments:

- Type of partner sought: Industry

- Specific area of activity of the partner: Any area where patterning of flexible substrates is needed, e g electronics, component manufacturing, RFID, antennas, flexible PCB, heating foils, ...

- Task to be performed by the partner sought: Implementation and adaptation of the DPP system in existing or new process line.

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